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![]() IC insertion machine. 2. Straight terminals are available for manual inser- ![]() tion. 3. Insert molding of terminals and ultrasonic wel- ding improve flux proofness and enable flux was- ![]() hing in whole by top tape sealing. ![]() 4. 30 series (raised actuator) and 30R series |
![]() ![]() ses. ![]() 5. Double contacts offers high reliability. ![]() 6. Vapour phase solderable, IR-reflow solderable. ![]() Terminal plating by gold give excellent results when ![]() soldering. ![]() Terminal plating: tin/lead available too. |
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![]() tions: ![]() Keep all switch contacts in their“OFF” position for all operations. ![]() Wave soldering: recommended solder temperature at 500 ºF (260 ºC) max. 5 seconds. ![]() Hand soldering: use a soldering iron of 30 Watts, controlled at 608 ºF (320 ºC) approximately 2 ![]() seconds while applying solder. Cleaning process: flux clean using force rinse, high ![]() agitation or triple bath cleaning method. Freon TF or TE give excellent results. ![]() When vapour methods are used, do not subject |
125 ºF (51ºC). ![]() Care should be exercised so that flux from the upper part of the printed circuit board does not ![]() adhere to the switch. Do not clean the switch body except with top tape ![]() sealed type, which can only spray of cleaning method from top s/w. |
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31R in tape & reel package with all poles in the “OFF” position. |
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